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Memory giant SK Hynix is ​​deepening its partnership with TSMC and NVIDIA and plans to announce a closer partnership at Semicon Taiwan in September, BusinessKorea reported.

SK Hynix and TSMC have a long history of cooperation. In 2022, TSMC announced the establishment of the OIP 3DFabric Alliance at its North American Technology Symposium, which included partners in the memory and packaging fields. Lee Kang-wook, senior vice president of SK Hynix and head of PKG development, revealed that the company has been working closely with TSMC on previous and current high-bandwidth memory (HBM) technologies to ensure compatibility with the CoWoS process and HBM interconnects.

After joining the 3DFabric Alliance, SK Hynix intends to further strengthen its cooperation with TSMC to jointly develop the next generation of HBM solutions, aiming to achieve innovation in system-level products. SK Hynix President Kim Jung-wook is expected to deliver a keynote speech at the Taipei International Semiconductor Show in September, which will be the first time SK Hynix has participated in such a keynote speech. After the speech, Kim Jung-wook will hold talks with TSMC and executives, including Nvidia CEO Jensen Huang, to discuss cooperation plans for the next generation of HBM, which is expected to further consolidate the three-party alliance between SK Hynix, TSMC and Nvidia.

There have been signs of cooperation among the three giants in the first half of this year. On April 25, SK Group Chairman Chey Tae-won went to Silicon Valley to meet with Nvidia CEO Huang Renxun to discuss issues that may be related to this strategy.

SK Hynix will reportedly use TSMC's logic process to manufacture HBM (high bandwidth memory) substrate chips. The two parties have agreed to cooperate in the development and production of HBM4, which is scheduled to be put into mass production in 2026. HBM technology vertically stacks core chips on a substrate and interconnects them. Although SK Hynix currently uses its own process to produce HBM3e substrates, it will switch to TSMC's advanced logic process to manufacture HBM4. Other reports indicate that SK Hynix will highlight its achievements at the forum, including that HBM4 has achieved more than 20% power consumption reduction compared to the initial target.