Technology Sharing

한어Русский языкEnglishFrançaisIndonesianSanskrit日本語DeutschPortuguêsΕλληνικάespañolItalianoSuomalainenLatina

Morning: Preparation and Inspection

7:00 AM - Wake up and get ready

Factory workers get up early, wash up quickly and have breakfast. In order to stay efficient during the day's work, they will do some morning exercises to keep their minds clear and their bodies energetic.

8:00 AM - Arrive at the factory

Employees arrive at Intel's semiconductor manufacturing plant, put on cleanroom suits, and ensure the cleanliness of themselves and the environment to avoid any dust and particles affecting production quality.

8:30 AM - Equipment Check

Technicians began to conduct routine inspections on all equipment in the factory to ensure that key equipment such as lithography machines, etching equipment, and ion implanters were operating normally. They would check the status of equipment in each link one by one according to the predetermined inspection list to ensure that there were no faults.

Morning: Wafer processing and inspection

9:00 AM - Wafer Processing

The production line is officially started, and silicon wafers are sent to various processing links. The wafers are first cleaned and prepared, and then enter the photolithography workshop, where technicians use high-precision photolithography machines to project circuit patterns onto the wafers.

10:00 AM - Lithography and Etching

After the photolithography is completed, the wafer is sent to the etching workshop. Technicians use etching equipment to remove materials outside the photolithography pattern to form tiny circuit structures. This is an extremely precise process that requires strict control of the depth and uniformity of etching.

11:00 AM - Ion Implantation

The next step is ion implantation, where technicians inject dopants into specific areas of the wafer to adjust its electrical properties. This process requires the control of high-energy ion beams to ensure uniform doping.

12:00 PM - Lunch time

Employees enjoy lunch and a break in the factory cafeteria. Technicians use this time to chat and relax, relieving the stress of the morning work.

Afternoon: Inter-layer connection and testing

1:00 PM - Interlayer Connection

The afternoon work began with the interlayer connection process. Technicians connected circuits at different levels to each other through multiple processes such as deposition, photolithography and etching to form a complex multi-layer circuit structure.

3:00 PM - Quality Inspection

Every step of production is subject to rigorous quality inspections. Quality inspectors use scanning electron microscopes (SEMs) and other advanced inspection equipment to check the structure and dimensions of the circuits to ensure that they meet design specifications.

4:00 PM - Packaging and Testing

The chips that have completed wafer processing are cut into individual chips and then packaged. The packaged chips need to undergo electrical testing to ensure that the functions and performance of each chip meet the standards. Technicians will mark and analyze unqualified chips to find out the problems.

5:30 PM - End of Day Summary

The operations manager and the technician team conduct a day-end summary to review the day's production, discuss problems encountered and solutions, and set tomorrow's work priorities.

6:00 PM - Clean up and wrap up

Technicians and cleaners clean the workshops and work areas to ensure a clean and hygienic environment. Some equipment will continue to operate at night to maintain the continuity of the production line.

Evening: study and rest

6:30 PM – Time to go home

Employees go home, enjoy dinner and family time, and try to unwind without doing work-related stuff.